Sushil H. Bhavnani : rechercher sur Z-Library

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1

Estimation of Biomass Synthesis Gas Composition using Equilibrium Modeling

Gautam, Gopal, Adhikari, Sushil, Bhavnani, Sushil

Journal:

Année:

2010

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2010

2

Effect of surface geometry and orientation on laminar natural convection heat transfer from a vertical flat plate with transverse roughness elements

Sushil H. Bhavnani, Arthur E. Bergles

Journal:

International Journal of Heat and Mass Transfer

Année:

1990

Langue:

english

Fichier:

PDF, 1.69 MB

english, 1990

3

[IEEE 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2014.3.9-2014.3.13)] 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing

Ramakrishnan, Bharath, Bhavnani, Sushil H., Gess, Joshua, Knight, Roy W., Harris, Daniel, Johnson, R. Wayne

Année:

2014

Langue:

english

Fichier:

PDF, 732 KB

english, 2014

4

[IEEE 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2014.3.9-2014.3.13)] 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model

Gess, Joshua, Bhavnani, Sushil, Ramakrishnan, Bharath, Johnson, R. Wayne, Harris, Daniel, Knight, Roy, Hamilton, Michael, Ellis, Charles

Année:

2014

Langue:

english

Fichier:

PDF, 606 KB

english, 2014

5

Self-Propelled Sliding Bubble Motion Induced by Surface Microstructure in Pool Boiling of a Dielectric Fluid Under Microgravity

Thiagarajan, Naveenan, Bhavnani, Sushil H., Narayanan, Vinod

Journal:

Journal of Electronic Packaging

Année:

2015

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2015

6

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Gess, Joshua, Bhavnani, Sushil, Wayne Johnson, R.

Journal:

Journal of Electronic Packaging

Année:

2016

Langue:

english

Fichier:

PDF, 3.73 MB

english, 2016

7

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Journal:

Journal of Electronic Packaging

Année:

2015

Langue:

english

Fichier:

PDF, 2.69 MB

english, 2015

8

Effect of nucleation site spacing on the pool boiling characteristics of a structured surface

Nitesh D. Nimkar, Sushil H. Bhavnani, Richard C. Jaeger

Journal:

International Journal of Heat and Mass Transfer

Année:

2006

Langue:

english

Fichier:

PDF, 488 KB

english, 2006

9

Development of an anodically-bonded test surface to obtain fundamental liquid immersion thermal management data for electronic devices

Nitesh D. Nimkar, Sushil H. Bhavnani, Charles D. Ellis, Richard C. Jaeger

Journal:

Sensors and Actuators A: Physical

Année:

2004

Langue:

english

Fichier:

PDF, 283 KB

english, 2004

10

Development of a Heat Sink With Periodic Asymmetric Structures Using Grayscale Lithography and Deep Reactive Ion Etching

Thiagarajan, Naveenan, Kapsenberg, Florian, Narayanan, Vinod, Bhavnani, Sushil H., Ellis, Charles D.

Journal:

IEEE Electron Device Letters

Année:

2012

Langue:

english

Fichier:

PDF, 254 KB

english, 2012

11

Investigation into the application of low melting temperature alloys as wet thermal interface materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Johnson, R. Wayne, Nguyen, Jonathan L., Knight, Roy W., Harris, Daniel K.

Journal:

International Journal of Heat and Mass Transfer

Année:

2015

Langue:

english

Fichier:

PDF, 1010 KB

english, 2015

12

A Multiscale Model of Thermal Contact Resistance Between Rough Surfaces

Jackson, Robert L., Bhavnani, Sushil H., Ferguson, Timothy P.

Journal:

Journal of Heat Transfer

Année:

2008

Langue:

english

Fichier:

PDF, 265 KB

english, 2008

13

[ASME ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels - Rio Grande, Puerto Rico, USA (Sunday 8 July 2012)] Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer - Cooling of High-Performance Server Modules Using Direct Immersion

Sridhar, Aravind, Styslinger, Sarah, Duron, Christopher, Bhavnani, Sushil H., Knight, Roy W., Harris, Daniel, Johnson, R. Wayne

Année:

2012

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2012

14

[ASME ASME 2011 5th International Conference on Energy Sustainability - Washington, DC, USA (August 7–10, 2011)] ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C - Exploration of Renewable Energy Usage in a Cement Kiln Using Downdraft Gasification of Poultry Litter

Hains, Bryant T., Burch, Thomas E., Bhavnani, Sushil H., Brodbeck, Christian J.

Année:

2011

Langue:

english

Fichier:

PDF, 1.27 MB

english, 2011

15

Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems

Gess, Joshua L., Bhavnani, Sushil H., Johnson, R. Wayne

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2015

Langue:

english

Fichier:

PDF, 2.80 MB

english, 2015

16

Experimental study of torrefied pine as a gasification fuel using a bubbling fluidized bed gasifier

Kulkarni, Avanti, Baker, Ryan, Abdoulmomine, Nourredine, Adhikari, Sushil, Bhavnani, Sushil

Journal:

Renewable Energy

Année:

2016

Langue:

english

Fichier:

PDF, 1.73 MB

english, 2016

17

Condensation on a horizontal surface with periodic asymmetrical structures – transient film growth

Natesh, Shashank, Truong, Eric, Narayanan, Vinod, Bhavnani, Sushil

Journal:

International Journal of Heat and Mass Transfer

Année:

2017

Langue:

english

Fichier:

PDF, 1.92 MB

english, 2017

18

Durability of Low Melt Alloys as Thermal Interface Materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Wayne Johnson, R., Knight, Roy W., Harris, Daniel K.

Journal:

Journal of Electronic Packaging

Année:

2016

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2016

19

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Année:

2015

Langue:

english

Fichier:

PDF, 7.37 MB

english, 2015

20

[ASME ASME 2015 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 13 November 2015)] Volume 8A: Heat Transfer and Thermal Engineering - A Numerical Study of Multiphase Dielectric Fluid Immersion Cooling of Multichip Modules Including Effects of Nucleation Site Density and Bubble Departure Diameter Functions

Nguyen, Jonathan, Knight, Roy W., Bhavnani, Sushil H., Harris, Daniel K., Fincher, Seth, Gess, Joshua, Sridhar, Aravind

Année:

2015

Langue:

english

Fichier:

PDF, 2.04 MB

english, 2015

21

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Chandrasekaran, Sriram, Bhavnani, Sushil

Année:

2017

Langue:

english

Fichier:

PDF, 1.99 MB

english, 2017

22

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of subcooling, flow rate and surface characteristics on flow boiling performance of high performance liquid cooled immersion server model

Chandrasekaran, Sriram, Gess, Joshua, Bhavnani, Sushil

Année:

2017

Fichier:

PDF, 501 KB

2017

23

Experimental study of augmented flow boiling in a dielectric fluid due to backward and forward facing stepped microchannels

Gao, Le, Bhavnani, Sushil H.

Journal:

International Journal of Heat and Mass Transfer

Année:

2018

Langue:

english

Fichier:

PDF, 2.08 MB

english, 2018

24

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Staggered and In-Line Submerged Liquid Jet Arrays for Power Electronics Using Variable Area Discharge Manifolds: Part II - Numerical

Reid, Kayla E., Henry, Michael A., Knight, Roy W, Bhavnani, Sushil H., Maddox, John F.

Année:

2018

Langue:

english

Fichier:

PDF, 1.64 MB

english, 2018

25

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Staggered and In-line Submerged Jet Arrays for Power Electronics Using Variable Area Discharge Manifolds: Part I – Experimental

Henry, Michael A., Reid, Kayla E., Bhavnani, Sushil H., Knight, Roy W., Maddox, John F., Brannon, William D.

Année:

2018

Langue:

english

Fichier:

PDF, 753 KB

english, 2018

26

A Numerical and Experimental Study of Staggered Submerged Liquid Jet Arrays Using Variable Angle Discharge Manifolds

Henry, Michael A., Reid, Kayla E., Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2019

Langue:

english

Fichier:

PDF, 8 KB

english, 2019

27

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Phase Change Cooling of Spacecraft Electronics: Terrestrial Reference Experiments Prior to ISS Microgravity Experiments

Sridhar, Karthekeyan, Smith, Ryan, Narayanan, Vinod, Bhavnani, Sushil

Année:

2020

Fichier:

PDF, 1.74 MB

2020

28

Computational fluid-dynamics modeling of the hydrodynamics of fluidization in the sand surrounding a lost-foam casting pattern

Nathanael Hudson, Sushil H. Bhavnani, Ruel A. Overfelt

Journal:

Metallurgical and Materials Transactions B

Année:

2002

Langue:

english

Fichier:

PDF, 1.69 MB

english, 2002

29

Boiling Augmentation with Micro/Nanostructured Surfaces: Current Status and Research Outlook

Bhavnani, Sushil, Narayanan, Vinod, Qu, Weilin, Jensen, Michael, Kandlikar, Satish, Kim, Jungho, Thome, John

Journal:

Nanoscale and Microscale Thermophysical Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 746 KB

english, 2014

30

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Lateral motion of bubbles from surfaces with mini ratchet topography modifications during pool boiling- experiments and preliminary model

Kapsenberg, Florian, Thiagarajan, Naveenan, Narayanan, Vinod, Bhavnani, Sushil

Année:

2012

Langue:

english

Fichier:

PDF, 993 KB

english, 2012

31

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Non-uniform thermal properties of an alumina granule/epoxy potting compound

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Année:

2010

Langue:

english

Fichier:

PDF, 779 KB

english, 2010

32

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model

Gess, Joshua, Bhavnani, Sushil, Ramakrishnan, Bharath, Johnson, R. Wayne, Harris, Daniel, Knight, Roy W., Hamilton, Michael, Ellis, Charles

Année:

2014

Langue:

english

Fichier:

PDF, 777 KB

english, 2014

33

Teamwork across Disciplinary Borders: A Bridge between College and the Work Place

Bhavnani, Sushil H., Aldridge, M. Dayne

Journal:

Journal of Engineering Education

Année:

2000

Langue:

english

Fichier:

PDF, 195 KB

english, 2000

34

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal characteristics of two-phase flow of a dielectric fluid in surface-augmented microchannels

Thiagarajan, Naveenan, Jones, Rory J., Pate, Daniel T., Bhavnani, Sushil H.

Année:

2008

Langue:

english

Fichier:

PDF, 3.50 MB

english, 2008

35

The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics

Bhavnani, Sushil H., Bar-Cohen, Avram, Joshi, Yogendra K.

Journal:

Journal of Engineering Education

Année:

2000

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2000

36

CONTROL OF INCIPIENCE HYSTERESIS EFFECTS IN LIQUID COOLED ELECTRONICS HEAT SINKS

BHAVNANI, SUSHIL H., BALCH, STACEY E., JAEGER, RICHARD C.

Journal:

Journal of Electronics Manufacturing

Année:

1999

Langue:

english

Fichier:

PDF, 243 KB

english, 1999

37

DIRECT IMMERSION COOLED MICROELECTRONICS HEAT SINKS: EFFECTS OF TEST FLUID AND BONDING TECHNIQUE

BHAVNANI, SUSHIL H., JAEGER, RICHARD C.

Journal:

Journal of Electronics Manufacturing

Année:

2000

Langue:

english

Fichier:

PDF, 814 KB

english, 2000

38

Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Johnson, R. Wayne, Knight, Roy W., Harris, Daniel K.

Journal:

Microelectronics Reliability

Année:

2015

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2015

39

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - TIM Selection for an IGBT Cold Plate Using Experimental and Numerical Modeling

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Année:

2013

Langue:

english

Fichier:

PDF, 1.63 MB

english, 2013

40

Thermal performance of low melting temperature alloys at the interface between dissimilar materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Johnson, R. Wayne, Knight, Roy W., Harris, Daniel K.

Journal:

Applied Thermal Engineering

Année:

2016

Langue:

english

Fichier:

PDF, 1.13 MB

english, 2016

41

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics

Nimkar, Nitesh D., Bhavnani, Sushil H., Jaeger, Richard C.

Année:

2003

Langue:

english

Fichier:

PDF, 317 KB

english, 2003

42

[IEEE 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2015.3.15-2015.3.19)] 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Local thermal measurements of a confined array of impinging liquid jets for power electronics cooling

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H.

Année:

2015

Langue:

english

Fichier:

PDF, 477 KB

english, 2015

43

[IEEE 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2015.3.15-2015.3.19)] 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Performance of low melt alloys as thermal interface materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Mike, Johnson, Wayne R., Knight, Roy W., Harris, Daniel K.

Année:

2015

Langue:

english

Fichier:

PDF, 369 KB

english, 2015

44

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Durability of Low Melt Alloys as Thermal Interface Materials

Roy, Chandan K., Harris, Daniel K., Bhavnani, Sushil, Hamilton, Michael C., Johnson, Wayne, Knight, Roy W.

Année:

2015

Langue:

english

Fichier:

PDF, 2.14 MB

english, 2015

45

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Experimental Investigation of Flow Boiling in a Single, Surface-Augmented Silicon Microchannel

Thiagarajan, Naveenan, Pate, Daniel T., Bhavnani, Sushil H., Jones, Rory J.

Année:

2009

Langue:

english

Fichier:

PDF, 2.15 MB

english, 2009

46

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - On the Lateral Motion of Bubbles Generated From Re-Entrant Cavities Located on Asymmetrically Structured Surfaces

Thiagarajan, Naveenan, Kapsenberg, Florian, Narayanan, Vinod, Bhavnani, Sushil H., Ellis, Charles

Année:

2011

Langue:

english

Fichier:

PDF, 547 KB

english, 2011

47

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Condensate mobility actuated by microsurface topography and wettability modifications

Duron, Christopher, Bhavnani, Sushil, Narayanan, Vinod, Morris, Jacob

Année:

2016

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2016

48

DIRECTIONAL PASSIVE CONDENSATE FILM DRAINAGE ON A HORIZONTAL SURFACE WITH PERIODIC ASYMMETRICAL STRUCTURES

Natesh, Shashank, Truong, Eric, Narayanan, Vinod, Bhavnani, Sushil H.

Journal:

Journal of Heat Transfer

Année:

2017

Langue:

english

Fichier:

PDF, 2.90 MB

english, 2017

49

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Gess, Joshua, Dreher, Tyler, Bhavnani, Sushil, Johnson, Wayne

Année:

2015

Langue:

english

Fichier:

PDF, 2.39 MB

english, 2015

50

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Correlation for single phase liquid jet impingement with an angled confining wall for power electronics cooling

Maddox, John F., Knight, Roy W., Bhavnani, Sushil H., Pool, James

Année:

2016

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2016